SJ/T 11654-2016 English PDF (SJ/T11654-2016)

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SJ/T 11654-2016: General Specification for Solid State Disk
SJ/T 11654-2016
SJ
ELECTRONIC INDUSTRY STANDARD
OF THE PEOPLE’S REPUBLIC OF CHINA
ICS 35.220.20
L 63
Report No.:
General Specification for Solid State Disk
ISSUED ON: APRIL 05, 2016
IMPLEMENTED ON: SEPTEMBER 01, 2016
Issued by: Ministry of Industry and Information Technology of the People’s
Republic of China
Table of Contents
Foreword ... 3
1 Scope ... 4
2 Normative References ... 4
3 Terms and Definitions ... 5
4 Requirements ... 7
5 Test Method ... 12
6 Quality Assessment Procedures ... 20
7 Marking, Packaging, Transportation, and Storage ... 22
Appendix A (Informative) Product Appearance and Installation Size ... 24
Appendix B (Informative) Interface ... 28
Appendix C (Normative) Failure judgment ... 34
General Specification for Solid State Disk
1 Scope
This Standard specifies the requirements, test method, quality assessment procedure, marking,
packaging, transportation and storage of solid-state disk.
This Standard is applicable to the design, production, manufacture and inspection of the solid-
state disk (hereinafter refer to as “product”); reference may also be made to other devices
containing solid-state disk functional modules.
2 Normative References
The following documents are essential to the application of this Document. For the dated
documents, only the versions with the dates indicated are applicable to this Document; for the
undated documents, only the latest version (including all the amendments) is applicable to this
Document.
GB/T 191 Packaging – Pictorial Marking for Handling of Goods
GB/T 2421.1 Environmental Testing for Electric and Electronic products - General and
Guidance
GB/T 2422 Environmental testing for electric and electronic products - Terms and
definitions
GB/T 2423.1 Environmental testing for electric and electronic products - Part 2: Test
methods - Tests A: Cold
GB/T 2423.2 Environmental testing for electric and electronic products - Part 2: Test
methods - Tests B: Dry heat
GB/T 2423.3 Environmental testing for electric and electronic products - Part 2: Test
methods - Test Ca: Damp heat, steady state
GB/T 2423.5 Environmental testing for electric and electronic products - Part 2: Test
methods – Test Ea and guidance: Shock
GB/T 2423.10 Environmental testing for electric and electronic products - Part 2: Test
methods – Test Fc and guidance: Vibration (Sinusoidal)
NOTE 3: The semiconductor memory chips that make up the solid-state disk have the ability to be
programmed for many times.
3.2 Lifespan (Endurance)
Under the condition that the data is guaranteed to be correct, the number of times the solid-state
disk can normally perform read and write operations.
3.3 Nominal capacity
The solid-state disk capacity announced by the solid-state disk manufacturer that is calculated
in decimal numbers.
NOTE: It is expressed by GB or TB; thereof, 1GB=109 bytes, and 1TB=1012 bytes.
3.4 Data transfer rate
The number of data bits transmitted per unit time that is calculated in a binary number.
NOTE: It is expressed by Mb/sec or Gb/sec; thereof, Mb/sec=220bit/sec, and Gb/sec=230bit/sec.
3.5 Read performance
The number of data bytes read from the solid-state disk per unit time or the number of read
operations per unit time.
3.6 Write performance
The number of data bytes written to the solid-state disk per unit time or the number of write
operations per unit time.
3.7 Recoverable read error
An error occurred while reading data, and the error is recoverable within the specified number
of retries.
3.8 Unrecoverable read error
An error that is found when reading data, and the error is not recoverable within the specified
number of retries.
3.9 Power on to ready time
Time that is required from power-on to data readout.
3.10 Interface
The interface for connecting the solid-state disk to other devices.
3.11 Active power consumption
Energy consumption when the solid-state disk is in the read/write state.
NOTE: The unit is Joule (J).
3.12 Idle power consumption
Energy consumption when the solid-state disk is in the idle state.
NOTE: The unit is Joule (J).
4 Requirements
4.1 Appearance and structure
4.1.1 General requirements
There shall be no obvious dents, scratches, cracks, deformations, etc. on the surface of the
product; the surface coating shall not be blistered, cracked or peeled off; and the metal parts
shall not be rusted or otherwise mechanically damaged.
There is no damage to the connector; and it is easy to plug and unplug. Other parts shall be firm
and not loose.
The texts and symbols and explaining the function, and function display shall be clear and
correct.
4.1.2 Structure size
4.1.2.1 1.8’’ solid-state disk
The schematic diagram of the shape and structure of 1.8’’ solid-state disk can refer to Appendix
A. The pin arrangement and its dimension can refer to Appendix B.
4.1.2.2 2.5’’ solid-state disk
The schematic diagram of the shape and structure of 2.5’’ solid-state disk can refer to Appendix
A. The pin arrangement and its dimension can refer to Appendix B.
4.1.2.3 3.5’’ solid-state disk
The schematic diagram of the shape and structure of 3.5’’ solid-state disk can refer to Appendix
A. The pin arrangement and its dimension can refer to Appendix B.
4.1.2.4 Solid-state disks of other sizes
a) If the power loss occurs when the product controller is writing data into the flash memory
chip: in this case, the loses the file data being operated are allowed; and no hardware
damage is required;
b) If the power loss occurs when the product controller is not writing data to the flash
memory chip: in this case, no data loss or error is allowed.
4.6 Lifespan
The lifespan shall meet the lifespan requirements stipulated in the product manual.
4.7 Error rate
In the 25°C temperature environment, when the relative humidity of the extreme environment
does not exceed 65%, there shall be no more than one unrecoverable read error rate for every
1013 data reads.
4.8 Security
4.8.1 General requirements
The general security requirements of the product shall comply with the provisions of 1.3 in GB
4943.1-2011.
4.8.2 Touch current
The touch current of the product shall comply with the provisions of 5.1 in GB 4943.1-2011.
4.8.3 Dielectric strength
The dielectric strength of the product shall comply with the provisions of 5.2 in GB 4943.1-
2011.
4.8.4 Ground continuity
The ground continuity of the product shall comply with the provisions of 2.6 in GB 4943.1-
2011.
4.8.5 Protection function
The product shall have protection functions such as overcurrent, overvoltage and short circuit,
etc.
4.9 Power accommodation capacity
The product shall work normally under the conditions with voltage of 12V±10% and 5V±5%.
The product shall have the protection functions such as overcurrent, overvoltage and short
circuit, etc.
GB/T 26572.
5 Test Method
5.1 Test environmental condition
In addition to climate environmental test and reliability test, other tests in this Standard shall be
carried out under standard atmospheric conditions for testing:
a) Temperature: 15°C~35°C;
b) Relative humidity: 25%~75%;
c) Atmospheric pressure: 86kPa~106kPa.
In all test items, the magnetic field strength around the sample under test shall not exceed 2000
A/m; and the air shall not contain salt spray and corrosive substances.
5.2 Appearance and structure test
The appearance of the product is tested by manual visual inspection; the shape dimension of
the product is tested by a length measuring instrument; and the weight of the product is tested
by a precision weight measuring instrument. All tests shall meet the requirements of 4.1.
NOTE: The product during the appearance and weight inspection shall be the product that has been
pasted with various labels.
5.3 Power on to ready time test
The time interval between when the test product is powered on and ready to start read/write
operations. Repeat the test 1000 times; and then take the average value as the power on to ready
time.
5.4 Data transfer rate test
5.4.1 Simple sequential read data capability test
Continuously send 10,000 read requests to the product; the start address of each read request is
the end address of the previous read request; record the response time of each request; and
calculate the data bandwidth according to Formula (1).
Where:
B – data bandwidth under such experimental condition;
TR0 – response time at the zero request, in s;
TR1 – response time at the 1st request, in s, and so on;
S - the size of the requested data is set to 2KB and 1MB in the experiment, and the performance
of small/large block reading and writing can be obtained, respectively.
5.4.2 Simple random read data capability test
Continuously send 10,000 read requests to the product; the start address of each read request is
randomly generated between 0 and the maximum logical address; record the response time of
each request; and calculate the data bandwidth according to Formula (1).
5.4.3 Simple sequential write data capability test
Continuously send 10,000 write requests to the product; the start address of each write request
is the end address of the previous write request; record the response time of each request; and
calculate the data bandwidth according to Formula (1).
NOTE: The data written down is randomly generated.
5.4.4 Simple random data writing capability test
Continuously send 10,000 write requests to the product; the start address of each write request
is randomly generated between 0 and the large sector number; record the response time of each
request; and calculate the data bandwidth according to Formula (1).
NOTE: The data written down is randomly generated.
5.5 Power consumption test
5.5.1 Active power consumption
Use the four methods in 5.4; record the working voltage, working current, and working time of
the solid-state disk under these four methods at the same time; and then obtain the working
power consumption under these four methods, respectively. The power consumption is
calculated according to Formula (2). [Translator’s note: There is background watermark in
some formulas and figures]
Where:
E - the energy consumed to serve the target load, in J;
I – average working current, in A;
NOTE: Both the amount of written data and the number of days can be used as the measurable indicator.
5.8 Error rate test
It shall be carried out according to the provisions of GB/T 5080.7.
5.9 Security test
5.9.1 General security test
It shall be carried out according to the provisions of 1.4 in GB 4943.1-2011.
5.9.2 Touch current test
The touch current test shall be measured according to the provisions of 5.1 in GB 4943.1-2011;
its limit value shall not exceed the maximum current in Table 5A of GB 4943.1-2011.
5.9.3 Dielectric strength test
The dielectric strength test shall be carried out according to the provisions of 5.2 in GB 4943.1-
2011; the voltage maintenance time for the type inspection and periodic inspection is 60s; and
the batch-by-batch inspection is maintained for 1s. During the test, the insulation shall not be
broken down.
Batch-by-batch inspection (including end of production line) for dielectric strength is carried
out only once per product.
5.9.4 Grounding continuity test
The grounding continuity test shall be carried out according to the provisions of 2.6 in GB
4943.1-2011. The connection resistance between the ground terminal and the parts that need to
be grounded (such as the external box) shall not exceed 0.1Ω.
5.10 Power accommodation capacity test
5.10.1 Voltage withstand test
The power accommodation capacity test is tested 3 times according to the upper and lower
limits of the voltage that can be tolerated; and the sample under test shall work normally.
5.10.2 Overcurrent protection value test
The input voltage is the nominal voltage; the initial load current is the rated load; and the current
climbs at a rate of 0.1A/s.
When the product is working normally under the above conditions, gradually increase the
current. When the load current enters the over-current protection range, it shall be automatically
protected. After the over-current is removed, it shall be able to work normally after restarting
or automatically recovering.
5.10.3 Short circuit test
When the input voltage is the nominal value and the minimum load current is set to 10% of the
rated current, the product works normally, and then the output voltage is artificially short-
circuited, and the short-circuit impedance shall be less than 100mΩ, the short-circuit time is at
least 1s; then the product shall be able to automatically protected. Restart or automatic restore
after troubleshooting, the product should work normally.
5.10.4 DC overvoltage protection action value test
When the input voltage is the nominal value and the load current is 5% of the rated load, adjust
the output voltage to generate overvoltage. When the output voltage exceeds the overvoltage
protection value, the product shall be automatically protected. Restart or automatically restore
after troubleshooting, the product shall work normally. Use an oscilloscope to measure the
overvoltage protection value and the time it takes to return to 110% of the nominal value. If it
is difficult to test according to this method, then turn to analyze the product circuit to confirm
whether the product has the output overvoltage protection function.
5.11 Climate environmental adaptability test
5.11.1 General requirements
In this Standard, the principals and terms of environmental test methods shall comply with the
relevant provisions of GB/T 2421.1 and GB/T 2422.
5.11.2 Temperature lower limit test
5.11.2.1 Working temperature lower limit test
It shall be carried out according to "Test Ad" of GB/T 2423.1. The sample under test must be
subjected to initial testing, and the severity shall be the lower limit of the specified working
temperature. When the temperature reaches th...